Title
SCC thermal model identification via advanced bias-compensated least-squares
Abstract
Compact thermal models and modeling strategies are today a cornerstone for advanced power management to counteract the emerging thermal crisis for many-core systems-on-chip. System identification techniques allow to extract models directly from the target device thermal response. Unfortunately, standard Least Squares techniques cannot effectively cope with both model approximation and measurement noise typical of real systems. In this work, we present a novel distributed identification strategy capable of coping with real-life temperature sensor noise and effectively extracting a set of low-order predictive thermal models for the tiles of Intel's Single-chip-Cloud-Computer (SCC) many-core prototype.
Year
DOI
Venue
2013
10.7873/DATE.2013.060
DATE
Keywords
Field
DocType
noise,temperature measurement,high level synthesis,speculation,noise measurement
Least squares,Thermal model,Thermal,Computer science,Advanced Power Management,High-level synthesis,Real-time computing,Electronic engineering,System identification,Real systems
Conference
ISSN
Citations 
PageRank 
1530-1591
7
0.45
References 
Authors
9
5
Name
Order
Citations
PageRank
Roberto Diversi19715.91
Andrea Bartolini245751.90
Andrea Tilli322117.74
Francesco Beneventi4465.73
Luca Benini5131161188.49