Abstract | ||
---|---|---|
Due to the rapidly growing MEMS initiator market and the needs for smaller, safer and higher integration, more advanced switches are in demand. The novel solid MEMS switch can improve the security and reliability of MEMS initiator, while the leads of its package are weak under high impact. This paper mainly studied the leads reliability of the novel solid MEMS switch under high impact by FEM simulation analysis. Through simulation analysis, the mainly weakness and the potential failure modes of the leads under high impact can be obtained, which can provide theory reference for the design and application of the novel solid MEMS switch. |
Year | DOI | Venue |
---|---|---|
2013 | 10.1109/NEMS.2013.6559838 | NEMS |
Keywords | Field | DocType |
solid mems switch,the novel solid mems switch,mems initiator market,high impact,high-impact-induced failure,failure analysis,leads,fem simulation analysis,simulation,microswitches,reliability,mems initiator security,potential failure modes,mems initiator reliability,strain,solids,finite element analysis,stress | Composite material,Microelectromechanical systems,Mechanical engineering,Finite element method,Materials science,Forensic engineering | Conference |
Volume | Issue | ISSN |
null | null | null |
ISBN | Citations | PageRank |
978-1-4673-6351-8 | 1 | 0.48 |
References | Authors | |
1 | 4 |
Name | Order | Citations | PageRank |
---|---|---|---|
Wang Ying | 1 | 1 | 0.48 |
Lou Wenzhong | 2 | 1 | 0.48 |
Yue Zhao | 3 | 104 | 18.48 |
Wang Fufu | 4 | 1 | 0.48 |