Title
Improving Semiconductor Reliability with Advanced Engineering Methods in Test Program Development
Abstract
dvancing semiconductor technology in combination with new assembly and packaging technologies are unfolding a new level of challenges for production testing. Reliability of semiconductors should be ensured by applying dedicated techniques within production testing addressing various aging aspects such as: device wear-out related degradation or reduced operational voltage headroom. Thus, test program quality is emerging as a major concern, as it is directly translating into microelectronics reliability and devices quality. With the heightened sensitivity of semiconductor technology to smallest deviations in test methods from the allowed operational range, the risk of accidentally degrading the integrated circuits reliability increases significant. In this paper we propose an approach that addresses the demand for improving semiconductor technology reliability production tests quality. The presented industry usage based case studies, in combination with described techniques, provide a set of valuable practical guidelines.
Year
DOI
Venue
2015
10.1007/s10836-014-5495-z
Journal of Electronic Testing: Theory and Applications
Keywords
Field
DocType
Accelerated life testing,Reliability,Semiconductor aging,Test equipment,Testing,Time to market
Computer science,Microelectronics,Electronic engineering,Accelerated life testing,Headroom (audio signal processing),Ongoing reliability test,Time to market,Reliability (semiconductor),Integrated circuit,Semiconductor,Reliability engineering
Journal
Volume
Issue
ISSN
31
1
0923-8174
Citations 
PageRank 
References 
0
0.34
8
Authors
3
Name
Order
Citations
PageRank
Stefan R. Vock161.21
Omar Escalona201.01
Colin Turner371.60