Paper Info
Title
120-Ghz-Band Amplifier Module With Hermetic Sealing Structure For 10-Gbit/S Wireless System
Abstract
This paper presents a 120-GHz-band amplifier module with a hermetic sealing structure for a broadband wireless system. The sealing structure for F-band waveguides is a laminate composed of two sealing plates and a spacer. Each sealing plate has a fused glass window and separates inside air from the ambient atmosphere. The design process of the sealing structure is simple and has good simulation fidelity. The hermetic sealing structure designed for an amplifier in a 120-GHz-band wireless link has an insertion loss of less than 1 dB and a return loss of more than 15 dB in the operating band. We made three kinds of sealed modules to evaluate the sealing function. The modules sealed with this technique meet the hermetic-seal standard in MIL-STD-883F. We then verified that the sealing structure on the sealed modules has a small enough effect for the transmittance of the intrinsic characteristics. In addition, we performed 10-Gbit/s data transmission using a sealed amplifier module with the bit error rate of less than 10(-10).
Year
DOI
Venue
2014
10.1587/transele.E97.C.583
IEICE TRANSACTIONS ON ELECTRONICS
Keywords
Field
DocType
millimeter-wave, waveguide, connection technique, wireless communication
Gigabit,Extremely high frequency,Wireless,Waveguide,Electronic engineering,Engineering,Electrical engineering,Amplifier
Journal
Volume
Issue
ISSN
E97C
6
1745-1353
Citations 
PageRank 
References 
0
0.34
0
Authors
6
Name
Order
Citations
PageRank
Hiroyuki Takahashi163.48
Toshihiko Kosugi201.35
Akihiko Hirata3105.67
Jun Takeuchi432.60
Koichi Murata500.34
Naoya Kukutsu6106.15