Title
Study of bending reliability and electrical properties of platinum lines on flexible polyimide substrates.
Abstract
•We reported in the bending reliability of Ti/Pt lines, sputtered on polyimide foil.•The change in electrical resistance was registered during circular bending tests.•The studied reliability issues included TCR, drift and bending at different radii.•We determined working limits of conductive lines for flexible electronics.
Year
DOI
Venue
2014
10.1016/j.microrel.2014.06.015
Microelectronics Reliability
Keywords
Field
DocType
Flexible electronics,Polymeric substrate,Bending reliability,Temperature coefficient of resistance
Electrical resistance and conductance,Curvature,Electrical conductor,Sputter deposition,Temperature coefficient,Photolithography,Electronic engineering,Flexible electronics,Bending,Engineering
Journal
Volume
Issue
ISSN
54
11
0026-2714
Citations 
PageRank 
References 
0
0.34
1
Authors
6
Name
Order
Citations
PageRank
Francisco Molina-Lopez100.34
R. E. de Araújo200.34
M. Jarrier300.34
Jérôme Courbat400.34
Danick Briand500.68
N. F. de Rooij611.50