Name
Title | ||
|---|---|---|
Microstructure and shear strength of Sn37Pb/Cu solder joints subjected to isothermal aging. |
Abstract | ||
|---|---|---|
•The formation of Cu–Sn IMC is mainly controlled by the diffusion mechanism.•The reflowed solder joint had better shear strength than the aged solder joints.•The shear strength of all aged solder joints decreased with increasing aging time. |
Year | DOI | Venue |
|---|---|---|
2014 | 10.1016/j.microrel.2014.04.003 | Microelectronics Reliability |
Keywords | Field | DocType |
Shear strength,Microstructure,Single-shear lap joint,Intermetallic compound (IMC),Aging | Microstructure,Shear strength,Shear (sheet metal),Intermetallic,Isothermal process,Eutectic system,Soldering,Metallurgy,Engineering,Ductility | Journal |
Volume | Issue | ISSN |
54 | 8 | 0026-2714 |
Citations | PageRank | References |
2 | 0.49 | 8 |
Authors | ||
5 | ||