Name
Title | ||
|---|---|---|
Electro- and thermomigration induced Cu3Sn and Cu6Sn5 formation in SnAg3.0Cu0.5 bumps. |
Abstract | ||
|---|---|---|
•AC stress tests on SnAgCu bumps on Cu contact pads.•Long- and short-term investigation of the Cu3Sn and Cu6Sn5 formation.•Material parameters for the modeling of the electromigration and thermomigration driven Cu3Sn and Cu6Sn5 formation. |
Year | DOI | Venue |
|---|---|---|
2015 | 10.1016/j.microrel.2014.09.030 | Microelectronics Reliability |
Keywords | Field | DocType |
Intermetallic compound (IMC) formation,Transient liquid phase soldering (TLPS),Electromigration,Thermomigration,Heat of transport,Effective charge of the moving ion | Mass flux,Intermetallic,Microelectronics,Electronic engineering,Soldering,Metallurgy,Miniaturization,Effective nuclear charge,Engineering,Electromigration,Fabrication | Journal |
Volume | Issue | ISSN |
55 | 1 | 0026-2714 |
Citations | PageRank | References |
1 | 0.41 | 5 |
Authors | ||
4 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Lutz Meinshausen | 1 | 8 | 3.47 |
| Hélène Frémont | 2 | 20 | 12.71 |
| Kirsten Weide-Zaage | 3 | 31 | 14.97 |
| Bernard Plano | 4 | 1 | 0.41 |