Title
Analysis inductively coupling wireless connection in 3D package
Abstract
A accuracy physical model and Greenhouse algorithm is presented in this paper in 3D package. A relative simple and fast method of calculation the coupling inductors coefficient is presented in this paper. The parameters of the inductors coupling is high efficiency are discussed. The appropriate position is calculated where the interference of inductor channel is minimum in the 3D package.
Year
DOI
Venue
2013
10.1109/ASICON.2013.6811861
ASICON
Keywords
Field
DocType
integrated circuit interconnections,greenhouse algorithm,inductively coupling wireless connection,three-dimensional integrated circuits,coupled circuits,3d package,inductive coupling,integrated circuit packaging,high speed interconnect,inductors,coupling inductor coefficient,inductor channel
Direct coupling,Wireless network,Coupling,Inductive coupling,Computer science,Inductor,Communication channel,Electronic engineering,Interference (wave propagation),Electrical engineering
Conference
ISSN
ISBN
Citations 
2162-7541
978-1-4673-6415-7
0
PageRank 
References 
Authors
0.34
3
5
Name
Order
Citations
PageRank
BaoCun Wang100.34
Guoyi Yu201.69
Xiaofei Chen3172.79
Li Zhang427242.02
Xavier Zou500.34