Title | ||
---|---|---|
On-line error detection and correction techniques for TSV in three-dimensional integrated circuit. |
Year | DOI | Venue |
---|---|---|
2011 | 10.1109/ISPACS.2011.6146105 | ISPACS |
Keywords | Field | DocType |
integrated circuit,error correction,three dimensional,error detection and correction,through silicon via,tsv,error detection | Computer vision,Computer science,Electronic engineering,Error detection and correction,Through-silicon via,Three-dimensional integrated circuit,Artificial intelligence,Integrated circuit,Embedded system | Conference |
Citations | PageRank | References |
3 | 0.47 | 9 |
Authors | ||
4 |
Name | Order | Citations | PageRank |
---|---|---|---|
Chang-Hsin Cheng | 1 | 9 | 3.13 |
Chung-Kai Liu | 2 | 53 | 2.69 |
Hsing-Chuang Liu | 3 | 16 | 3.40 |
Kung-Ming Ji | 4 | 7 | 1.71 |