Title
On-line error detection and correction techniques for TSV in three-dimensional integrated circuit.
Year
DOI
Venue
2011
10.1109/ISPACS.2011.6146105
ISPACS
Keywords
Field
DocType
integrated circuit,error correction,three dimensional,error detection and correction,through silicon via,tsv,error detection
Computer vision,Computer science,Electronic engineering,Error detection and correction,Through-silicon via,Three-dimensional integrated circuit,Artificial intelligence,Integrated circuit,Embedded system
Conference
Citations 
PageRank 
References 
3
0.47
9
Authors
4
Name
Order
Citations
PageRank
Chang-Hsin Cheng193.13
Chung-Kai Liu2532.69
Hsing-Chuang Liu3163.40
Kung-Ming Ji471.71