Title
A mm-sized implantable device with ultrasonic energy transfer and RF data uplink for high-power applications
Abstract
A first proof-of-concept mm-sized implant based on ultrasonic power transfer and RF uplink data transmission is presented. The prototype consists of a 1 mm × 1 mm piezoelectric receiver, a 1 mm × 2 mm chip designed in 65 nm CMOS and a 2.5 mm × 2.5 mm off-chip antenna, and operates through 3 cm of chicken meat which emulates human tissue. The implant supports a DC load power of 100 μW allowing for high-power applications. It also transmits consecutive UWB pulse sequences activated by the ultrasonic downlink data path, demonstrating sufficient power for an Mary PPM transmitter in uplink.
Year
DOI
Venue
2014
10.1109/CICC.2014.6946071
Custom Integrated Circuits Conference
Keywords
Field
DocType
CMOS integrated circuits,antennas,inductive power transmission,piezoelectric devices,prosthetics,ultrasonic waves,CMOS,DC load power,Mary PPM transmitter,RF data uplink,RF uplink data transmission,UWB pulse sequence,high-power applications,mm-sized implantable device,off-chip antenna,piezoelectric receiver,power 100 muW,size 1 mm,size 2 mm,size 2.5 mm,size 3 cm,size 65 nm,ultrasonic downlink data path,ultrasonic energy transfer,ultrasonic power transfer,AC-DC power converters,Implantable biomedical devices,mm-sized implants,radio transmitters,ultrasonic power delivery
Ultrasonic sensor,Transmitter,Data transmission,Computer science,Chip,CMOS,Converters,Electronic engineering,Maximum power transfer theorem,Electrical engineering,Telecommunications link
Conference
Citations 
PageRank 
References 
4
0.52
3
Authors
5
Name
Order
Citations
PageRank
Jayant Charthad1193.59
Marcus J. Weber2143.15
Ting Chia Chang3143.49
Mahmoud Saadat450.95
amin arbabian522735.52