Paper Info
Title
Cost-optimal design of wireless pre-bonding test framework
Abstract
In a three-dimensional stacked IC (3D-SIC), pre-bonding die tests are performed to test different functional components on dies as the yield of 3D-SIC highly depends on the quality of dies used for stacking. In observing the test challenges in pre-bonding, contactless wireless probing using inductive coupling has been introduced to provide high bandwidth test data transfer without the stress-induced damage. Aiming at high bandwidth high parallel pre-bonding test, a hybrid wireless test framework is established in this paper by utilizing such wireless probing techniques. Under the hybrid test framework, both IP cores and embedded TSVs are tested concurrently by applying scan methodology and BIST respectively. To exploit the performance-cost effectiveness of our new architecture, a test scheduling scheme is thereby proposed to optimize the test resource distribution and minimize test application time. The simulation study demonstrates the wireless test capability and the feasibility of a hybrid wireless test infrastructure.
Year
DOI
Venue
2014
10.1109/SOCC.2014.6948948
System-on-Chip Conference
Keywords
Field
DocType
built-in self test,integrated circuit bonding,integrated circuit design,integrated circuit testing,integrated circuit yield,three-dimensional integrated circuits,3D stacked integrated circuits,3D-SIC,BIST,IP cores,contactless wireless probing,cost-optimal design,embedded TSV,hybrid wireless test framework,inductive coupling,parallel pre-bonding test,test application time,test resource distribution,test scheduling scheme,wireless pre-bonding test framework
Wireless,Optimal design,Physical design,Engineering,Embedded system
Conference
Citations 
PageRank 
References 
3
0.39
9
Authors
2
Name
Order
Citations
PageRank
Unni Chandran130.39
Dan Zhao2383.54