Name
Abstract | ||
|---|---|---|
Properties of a new fine-line printed circuit board which are critical in the design of computer systems based on GaAs, 100 K and 10 K logic families, are characterized. The new PCB technology permits trace widths as fine as 0.002 in. on the inner layers of multilayer boards. While facilitating higher package density and controlled impedance interconnects with higher characteristic impedance (Z0 ), the technology opens questions of thermal reliability, ohmic heating, and noise margin. Cross-validating analytic and laboratory analysis is used to investigate each of these issues. Provided that several key issues are addressed during design, this report supports the use of 0.002 in. technology in high-performance computer systems |
Year | DOI | Venue |
|---|---|---|
1991 | 10.1109/ICCD.1991.139951 | Cambridge, MA |
Keywords | Field | DocType |
circuit layout,packaging,printed circuits,PCB technology,characteristic impedance,computer design,controlled impedance interconnects,fine-line printed circuit board,inner layers,logic families,multilayer boards,noise margin,ohmic heating,package density,thermal reliability,trace widths | Logic synthesis,Logic gate,Computer science,Printed circuit board,Circuit design,Electronic engineering,Electrical impedance,Characteristic impedance,Logic family,Noise margin,Electrical engineering | Conference |
ISBN | Citations | PageRank |
0-8186-2270-9 | 0 | 0.34 |
References | Authors | |
0 | 3 | |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Chi-Chai Huang | 1 | 0 | 0.34 |
| John Willis | 2 | 0 | 1.01 |
| Schmitt, T. | 3 | 0 | 0.68 |