Name
Abstract | ||
|---|---|---|
As integrated circuit technology improvements result in increased device speed, designers are forced to adopt new forms of packaging and interconnect such as multichip modules. A description is given of how planar optical interconnect techniques may be combined with a multichip module process to provide optical interconnect within the substrate. Several possible applications of the technology are briefly described |
Year | DOI | Venue |
|---|---|---|
1991 | 10.1109/ICCD.1991.139955 | Cambridge, MA |
Keywords | Field | DocType |
hybrid integrated circuits,integrated circuit technology,optical interconnections,packaging,integrated circuit technology,interconnect,optical multichip module,packaging,planar optical interconnect,substrate | Etching,Computer science,Planar,Optical refraction,Interconnection,Integrated circuit,Electrical engineering,Stimulated emission,Optical interconnect | Conference |
ISBN | Citations | PageRank |
0-8186-2270-9 | 0 | 0.34 |
References | Authors | |
1 | 2 | |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Alex Dickinson | 1 | 0 | 0.34 |
| Downs, M.M. | 2 | 0 | 0.34 |