Abstract | ||
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The performance features of MEMS transducers allow the development of a new class of small, low-power sensor microsystems which utilize a suite of sensors to support a wide range of applications. This paper presents a system-level framework for constructing such microsystems where system modularity for application adaptability is a primary design consideration. System architecture, communication protocols, modular packaging, and interface electronics are discussed in general terms, and an implementation of these concepts is presented. Key requirements for microsystem modularity, such as a communication bus and a universal microsensor interface circuit which support plug-n-play operation for online reconfiguration, are developed and presented in this paper. |
Year | DOI | Venue |
---|---|---|
2003 | 10.1109/ISCAS.2003.1205172 | Circuits and Systems, 2003. ISCAS '03. Proceedings of the 2003 International Symposium |
Keywords | Field | DocType |
low-power electronics,microsensors,MEMS transducer,communication bus,communication protocol,interface electronics,low-power microsensor,modular packaging,modular sensor microsystem,online reconfiguration,plug-n-play operation,system architecture,universal microsensor interface circuit | Microsystem,Computer science,Intelligent sensor,Electronic engineering,Electronics,Modular design,Systems architecture,Control reconfiguration,Modularity,Embedded system,Communications protocol | Conference |
Volume | ISBN | Citations |
3 | 0-7803-7761-3 | 0 |
PageRank | References | Authors |
0.34 | 2 | 4 |
Name | Order | Citations | PageRank |
---|---|---|---|
Andrew Mason | 1 | 24 | 4.66 |
Yazdi, N. | 2 | 0 | 0.34 |
Zhang, J. | 3 | 0 | 0.34 |
Sainudeen, Z. | 4 | 0 | 0.34 |