Name
Abstract | ||
|---|---|---|
Discusses techniques for detecting and diagnosing interconnect faults in MCM substrates. The methods use stimuli to measure the attenuation and phase variations resulting from interconnect defects such as opens, shorts and high resistance connections. The processes are compared to alternative techniques and provide better resolution in resistance measurement |
Year | DOI | Venue |
|---|---|---|
1995 | 10.1109/TEST.1995.529926 | Washington, DC |
Keywords | Field | DocType |
automatic testing,fault diagnosis,integrated circuit interconnections,multichip modules,MCM substrates,attenuation,diagnostics,high resistance connections,interconnect faults,multichip modules,opens,phase variations,repair,resistance measurement,shorts,troubleshooting | Troubleshooting,Computer science,Automatic testing,Electronic engineering,Attenuation,Interconnection | Conference |
ISSN | ISBN | Citations |
1089-3539 | 0-7803-2992-9 | 0 |
PageRank | References | Authors |
0.34 | 0 | 1 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| David C. Keezer | 1 | 45 | 9.64 |