Title
Improved sensitivity for parallel test of substrate interconnections
Abstract
A digital method has been introduced previously for testing the interconnections between signal pins within high-density substrates such as multichip modules. This technique, while very effective at detecting and diagnosing catastrophic faults (complete opens and low-resistance shorts), has limited sensitivity to “near” failures (resistive opens and high-resistance shorts). This paper quantifies the sensitivity of the original method for detecting several classes of near failures. The sensitivity is found to be on the order of 100 Ω for both near opens and near shorts in a typical implementation. To improve upon this, a significant variation on the original method is introduced. Rather than rely entirely on resistance differences to produce detectable voltage variations, the new approach couples these with a fixed capacitance to produce an RC rise-time change. The fault is then diagnosed with greater precision while still using fixed-threshold comparators
Year
DOI
Venue
1998
10.1109/TEST.1998.743156
Washington, DC
Keywords
Field
DocType
failure analysis,fault diagnosis,integrated circuit interconnections,multichip modules,sensitivity analysis,substrates,100 ohm,RC rise-time change,catastrophic faults,detectable voltage variations,fixed capacitance,fixed-threshold comparators,high-resistance shorts,low-resistance shorts,multichip modules,parallel test,resistive opens,sensitivity,substrate interconnections
Comparator,Capacitance,System testing,Computer science,Logic testing,Resistive touchscreen,Voltage,Field-programmable gate array,Electronic engineering,On resistance,Electrical engineering
Conference
ISSN
ISBN
Citations 
1089-3539
0-7803-5093-6
1
PageRank 
References 
Authors
0.48
1
3
Name
Order
Citations
PageRank
David C. Keezer1459.64
Kimberly Newman272.48
Davis, J.S.310.48