Name
Abstract | ||
|---|---|---|
Advanced thin film processing and packaging technologies are employed in the fabrication of new planar thin-film multijunction thermal converters. The processing, packaging, and design features build on experience gained from prior NIST demonstrations of thin-film converters with optimizations for improved sensitivity, bandwidth, manufacturability, and reliability. |
Year | DOI | Venue |
|---|---|---|
2001 | 10.1109/CPEM.2000.851038 | IEEE T. Instrumentation and Measurement |
Keywords | Field | DocType |
ceramic packaging,converters,photoresists,seals (stoppers),sputter etching,thermal management (packaging),thermocouples,thin film devices,transfer standards,voltage measurement,ac-dc transfer standard,advanced thin film processing,back-etching,ceramic package,deep rie,design features,dielectric membrane,fabrication process,hermetic seal,improved bandwidth,improved sensitivity,manufacturability,optimization,photoresist lift-off,planar thin-film multijunction thermal converter,reliability,resistive heater,thermal isolation,vacuum packaging technology,etching,sensitivity,silicon,design optimization,fabrication,thin film,packaging,transistors,gold,nist,bandwidth,indexing terms,sputtering | Etching,Electronic engineering,Converters,Bandwidth (signal processing),Planar,NIST,Thin film,Design for manufacturability,Electrical engineering,Fabrication,Physics | Journal |
Volume | Issue | ISBN |
50 | 2 | 0-7803-5744-2 |
Citations | PageRank | References |
4 | 0.80 | 0 |
Authors | ||
6 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| T. F. Wunsch | 1 | 4 | 0.80 |
| Joseph R. Kinard | 2 | 15 | 3.55 |
| ronald p manginell | 3 | 4 | 0.80 |
| otis m solomon | 4 | 4 | 0.80 |
| Lipe, T.E. | 5 | 6 | 2.37 |
| K. C. Jungling | 6 | 4 | 0.80 |