Name
Abstract | ||
|---|---|---|
In this paper we present a generic interconnect fabric for transaction level modelling tackeling three major aspects. First, a review of the bus and IO structures that we have analysed, which are common in todays system on chip environments, and require to be modelled at a transaction level. Second our findings in terms of the data structures and interface API's that are required in order to model those (and we believe other) busses and IO structures. Third the surrounding infrastructure that we believe can, and should be in place to support the modelling of those busses and IO structures. We will present the infrastructure that we have built, and indicate where our future work will hea. |
Year | DOI | Venue |
|---|---|---|
2006 | 10.1109/DAC.2006.229410 | San Francisco, CA |
Keywords | Field | DocType |
application program interfaces,public domain software,transaction processing,GreenBus,chip environments,data structures,generic interconnect fabric,interface API,transaction level modelling,Design,On-Chip Communication,Performance,SoC,SystemC,TLM,Verification | Transaction processing,Data structure,System on a chip,Computer science,Real-time computing,Electronic engineering,SystemC,Database transaction,Interconnection,Public domain software,Embedded system | Conference |
ISSN | ISBN | Citations |
0738-100X | 1-59593-381-6 | 17 |
PageRank | References | Authors |
1.15 | 4 | 4 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Wolfgang Klingauf | 1 | 25 | 1.90 |
| Gunzel, R. | 2 | 17 | 1.15 |
| Oliver Bringmann | 3 | 586 | 71.36 |
| Parfuntseu, P. | 4 | 17 | 1.15 |