Name
Abstract | ||
|---|---|---|
Surface peaks thermal detection is necessary in modern VLSI circuits; their internal stress due to packaging combined with local self heating becomes serious and may result in large performance variation, circuit malfunction and even chip cracking. This paper presents the design of surface peaks thermal detector algorithm (SPTDA) with flexible modular-based architecture. Several approaches were implemented to achieve a better performance for the SPTDA algorithm operation. A parallel processing strategy is used to minimize computational delay, and a hardware-efficient factoring approach for calculating tangent and division functions required by SPTDA algorithm is used to minimize silicon space in regards of their implementation. Description of the algorithm developed for the surface peaks thermal detection and the architecture implementation results are reported and compared with finite element method (FEM) temperature prediction. |
Year | DOI | Venue |
|---|---|---|
2007 | 10.1109/ASAP.2007.4429986 | Montreal, Que. |
Keywords | Field | DocType |
VLSI,finite element analysis,internal stresses,parallel processing,VLSI circuits,chip cracking,circuit malfunction,computational delay,finite element method temperature prediction,flexible modular-based architecture,hardware-efficient factoring approach,parallel processing strategy,surface peak thermal detector algorithm,FPGA,GDS technique,Sensors,Thermal Analysis,VLSI | Correlation coefficient,Computer science,Algorithm,Field-programmable gate array,Sensor fusion,Estimation theory,Very-large-scale integration,Wireless sensor network,Detector,Estimator | Conference |
ISSN | ISBN | Citations |
2160-0511 E-ISBN : 978-1-4244-1027-9 | 978-1-4244-1027-9 | 0 |
PageRank | References | Authors |
0.34 | 5 | 3 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Charbel Boustany | 1 | 0 | 0.34 |
| Ahmed Lakhsasi | 2 | 2 | 1.42 |
| Mohammed Bougataya | 3 | 0 | 1.01 |