Title
The Design of Outsourcing Planning for Semiconductor Backend Turnkey Service
Abstract
Wafer fabrications provide the semiconductor backend turnkey service (SBTS) that help their customers to handle the outsourcing business of the three backend processing stages including circuit probing testing, integrated circuit assembly, and final testing. When the process of wafer fabrication is completed, the SBTS provider needs to select appropriate outsourcing firms and to allocate the semi-finished orders to them. In the process of selecting suitable outsourcing firms, the SBTS providers consider the constraints of limited capacity, production cost, due dates, and the processing capabilities of each outsourcing firm. The planning problem for SBTS is very complicated because of requirement variations of orders and capability variations of outsourcing firms. In this paper, a mixed integer programming model for SBTS with the total cost minimization criterion is presented. A case is also provided to demonstrate its applicability of the IP model in real practice.
Year
DOI
Venue
2008
10.1109/NCM.2008.123
Networked Computing and Advanced Information Management, 2008. NCM '08. Fourth International Conference
Keywords
Field
DocType
integrated circuit testing,monolithic integrated circuits,outsourcing,business outsourcing,circuit probing testing,integrated circuit assembly,mixed integer programming model,outsourcing firms,outsourcing planning,semiconductor backend turnkey service,Semiconductor backend turnkey service (SBTS),outsourcing,wafer fabrication
Wafer,Computer science,Wafer fabrication,Outsourcing,Turnkey,Integer programming,Minification,Integrated circuit,Total cost,Reliability engineering,Distributed computing
Conference
Volume
ISBN
Citations 
2
978-0-7695-3322-3
0
PageRank 
References 
Authors
0.34
2
4
Name
Order
Citations
PageRank
Chung, S.H.100.34
Chung, I.P.200.34
Tai, Y.T.300.34
Chu, Y.M.400.34