Title
Study of mechanical response in embossing of ceramic green substrate by micro-indentation
Abstract
Micro-indentation test with a micro flat-end cone indenter was employed to simulate micro embossing process and investigate the thermo-mechanical response of ceramic green substrates. The laminated low temperature co-fired ceramic green tapes were used as the testing material; the correlations of indentation depth versus applied force and applied stress at the temperatures of 2SdegC and 75degC were studied. The results showed that permanent indentation cavities could be formed at temperatures ranging from 25degC to 75degC, and the depth of cavities created was applied force, temperature and dwell time dependent. Creep occurred and made a larger contribution to the plastic deformation at elevated temperatures and high peak loads. There was instantaneous recovery during the unloading and retarded recovery in the first day after indentation. There was no significant pile-up due to material flow observed under compression at the temperature up to 75degC. The plastic deformation was the main cause for formation of cavity on the ceramic green substrate under compression. The results can be used as a guideline for embossing ceramic green substrates.
Year
DOI
Venue
2008
10.1109/DTIP.2008.4753010
Computing Research Repository
Keywords
Field
DocType
ceramics,creep,embossing,indentation,plastic deformation,ceramic green substrate,indentation depth,mechanical response,micro flat-end cone indenter,microindentation test,temperature 25 degc to 75 degc,plastics,material flow,dwell time
Dwell time,Ceramic,Embossing,Compression (physics),Composite material,Indentation,Creep,Electronic engineering,Material flow,Deformation (engineering),Materials science
Journal
Volume
ISSN
ISBN
abs/0805.0
Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2008, Nice : France (2008)
978-2-35500-006-5
Citations 
PageRank 
References 
0
0.34
1
Authors
2
Name
Order
Citations
PageRank
Y. C. Liu100.34
Xuechuan Shan201.35