Name
Title | ||
|---|---|---|
ASIC for a resonant wireless pressure-sensing system for harsh environments achieving ±2% error between −40 and 150°C using Q-based temperature compensation |
Abstract | ||
|---|---|---|
Pressure sensors used in automotive applications are subject to increasingly harsh environments such as acid containing gases in vehicle exhausts or exhaust gas recirculation. State-of-the-art gel protection for sensing elements and their electronics is reaching its limit. A circuit's exposed aluminum bond pads are especially vulnerable to corrosion and failure. In response to these issues, we report an approach to eliminate bond pads and bonds between the sensor and IC altogether. |
Year | DOI | Venue |
|---|---|---|
2012 | 10.1109/ISSCC.2012.6176975 | Solid-State Circuits Conference Digest of Technical Papers |
Keywords | Field | DocType |
application specific integrated circuits,bonding processes,compensation,pressure sensors,asic,al,q-based temperature compensation,acid containing gases,aluminum bond pad,automotive application,corrosion,electronics,exhaust gas recirculation,failure,gel protection,harsh environment,pressure sensor,resonant wireless pressure-sensing system,sensing element,temperature -40 c to 150 c,vehicle exhaust,resonant frequency,oscillations,electronics packaging,oscillators,gain control,temperature measurement | Corrosion,Computer science,Electronic packaging,Electronic engineering,Application-specific integrated circuit,Electronics,Pressure sensor,Exhaust gas recirculation,Automatic gain control,Temperature measurement,Electrical engineering | Conference |
ISSN | ISBN | Citations |
0193-6530 | 978-1-4673-0376-7 | 3 |
PageRank | References | Authors |
0.50 | 3 | 3 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Marko Rocznik | 1 | 3 | 0.50 |
| Fabian Henrici | 2 | 42 | 7.94 |
| Remigius Has | 3 | 3 | 0.50 |