Name
Title | ||
|---|---|---|
Processing of 3D multilevel SU-8 fluidic network assisted by PerMX dry-photoresist lamination |
Abstract | ||
|---|---|---|
In this work we present a new manufacturing method for MEMS based multi-level microfluidic devices. The combination of spin-coating SU-8 (MicroChem) and lamination of PerMX dry-photoresist (DuPont) enables the fabrication of a complex 3-level microfluidic channel network with channel aspect ratios ranging from 0.3 up to 3. On 13 mm2 fluidic chip area we realized a complex 3D fluidic network by interconnecting three individual fluidic levels. The unique use of UV-photolithography tools and high-precision UV-lasering for the fluidic chip manufacturing results in 25 μm alignment accuracy between the fluidic levels. We further report on the high material compatibility of SU-8 and PerMX which results in high substrate adhesion of the fluidic devices (26.5 MPa). |
Year | DOI | Venue |
|---|---|---|
2012 | 10.1109/NEMS.2012.6196781 | Nano/Micro Engineered and Molecular Systems |
Keywords | DocType | ISBN |
laminations,microfluidics,photoresists,3D multilevel SU-8 fluidic network,MEMS based multilevel microfluidic devices,PerMX dry-photoresist lamination,UV-photolithography tools,complex 3-level microfluidic channel network,fluidic chip manufacturing,high-precision UV-lasering,manufacturing method,spin-coating SU-8,dry-resist lamination,multi-level fluidic network | Conference | 978-1-4673-1122-9 |
Citations | PageRank | References |
0 | 0.34 | 0 |
Authors | ||
4 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| R. Ch. Meier | 1 | 0 | 0.34 |
| Badilita, V. | 2 | 0 | 0.34 |
| Wallrabe, U. | 3 | 0 | 0.34 |
| Jan G. Korvink | 4 | 1 | 1.38 |