Title
CMOS scaling and beyond
Abstract
This session of exclusively invited papers covers a selection of wafer-level technology developments key to extending nanoscale CMOS. Specific topics are progress and outlook of lithography, copper interconnects, SOI-CMOS device architectures, and high-mobility channel CMOS technologies.
Year
DOI
Venue
2009
10.1109/CICC.2009.5280902
San Jose, CA, USA
Keywords
Field
DocType
cmos integrated circuits,logic gates,copper,data mining,lithography,cmos technology
Logic gate,Nanoscale cmos,Computer science,Communication channel,Electronic engineering,CMOS,Lithography,Cmos scaling,Electrical engineering
Conference
ISBN
Citations 
PageRank 
978-1-4244-4073-3
0
0.34
References 
Authors
0
2
Name
Order
Citations
PageRank
Takamaro Kikkawa16914.32
Lai, Jordan200.34