Paper Info
Title
Conductive behavior modeling of dual-axis CMOS MEMS convective accelerometers using 3D FEM and spherical model
Abstract
This paper presents heat conduction modeling of dual axis micromachined convective accelerometers. Results from FEM simulation are used to develop an analytical model of heat conduction main parameters. Two variables are used in FEM simulations: heater temperature and cavity depth. The latter parameter has a large impact on the overall conductive behavior of thermal accelerometers since it fixes the volume where the heat bubble can expand. Simulation results are used in a derived spherical model to develop an analytical expression of outer isotherm equivalent radius. The hot bubble radius and form are closely related to sensor geometry parameters and temperature. Two distinct equivalent radius modeling are studied and are used to express both heater heat transfer coefficient and common mode. These physically-based derived expressions govern the overall sensor conductive behavior. It is also shown that these derived expressions are still valid for different sensor design geometries.
Year
DOI
Venue
2013
10.1109/SSD.2013.6564151
Systems, Signals & Devices
Keywords
DocType
ISBN
cmos integrated circuits,accelerometers,finite element analysis,heat conduction,micromachining,microsensors,temperature measurement,temperature sensors,3d fem simulation,cavity depth,conductive behavior modeling,dual axis cmos mems convective accelerometer,equivalent radius modeling,heat bubble,heat conduction modeling,heater heat transfer coefficient,heater temperature,isotherm equivalent radius,sensor design geometry,sensor geometry parameter,sensor temperature,spherical model,thermal accelerometer,cmos,convective accelerometer,fem simulation,mems,mathematical model,heat transfer,heating
Conference
978-1-4673-6458-4
Citations 
PageRank 
References 
0
0.34
0
Authors
4
Name
Order
Citations
PageRank
Mezghani, B.100.34
F. Tounsi225.12
Yaich, H.300.34
Masmoudi, M.400.34