Title
Evaluating the scalability and performance of 3D stacked reconfigurable nanophotonic interconnects
Abstract
As we integrate hundreds of cores in the future, energy-efficiency and scalability of Network-on-Chips (NoCs) has become a critical challenge. In order to achieve higher performance-per-Watt than traditional metallic interconnects, researchers are exploring alternate energy-effident emerging technology solutions. In this paper, we propose to combine two emerging technologies, namely 3D stacking and nanophotonics that can deliver high on-chip bandwidth and low energy/bit to achieve a high-throughput, reconfigurable and scalable NoC for many-core systems. Our simulation results indicate that the execution time can be reduced up to 25% and energy consumption reduced by 23% for Splash-2, PARSEC, SPEC CPU2006 and synthetic benchmarks for 64-core and 256-core versions.
Year
DOI
Venue
2013
10.1109/SLIP.2013.6681676
System Level Interconnect Prediction
Keywords
Field
DocType
integrated circuit interconnections,integrated circuit reliability,nanophotonics,network-on-chip,256-core versions,3D stacked reconfigurable nanophotonic interconnects,64-core versions,NoC,PARSEC,SPEC CPU2006,Splash-2,energy-efficiency,many-core systems,metallic interconnects,network-on-chips,performance evaluation,scalability evaluation,synthetic benchmarks,technology solutions,Nanophotonics,NoCs,Reconfiguration
Parsec,Computer science,Network on a chip,Electronic engineering,Emerging technologies,Bandwidth (signal processing),Spec#,Energy consumption,Control reconfiguration,Scalability,Embedded system
Conference
Citations 
PageRank 
References 
0
0.34
1
Authors
3
Name
Order
Citations
PageRank
Randy Morris1343.72
Avinash Karanth Kodi2473.28
Ahmed Louri339847.97