Paper Info
Title
Thermal analysis and active cooling management for 3D MPSoCs
Abstract
3D stacked architectures reduce communication delay in multiprocessor system-on-chips (MPSoCs) and allowing more functionality per unit area. However, vertical integration of layers exacerbates the reliability and thermal problems, and cooling is a limiting factor in multi-tier systems. Liquid cooling is a highly efficient solution to overcome the accelerated thermal problems in 3D architectures. However, liquid cooling brings new challenges in modeling and run-time management. This paper proposes a design-time/run-time thermal management policy for 3D MPSoCs with inter-tier liquid cooling. First, we perform a design-time analysis to estimate the thermal impact of liquid cooling and dynamic voltage frequency scaling (DVFS) on 3D MPSoCs. Based on this analysis, we define a set of management rules for run-time thermal management. We utilize these rules to control and adjust the liquid flow rate in order to match the cooling demand for preventing energy wastage of over- cooling, while maintaining a stable thermal profile in the 3D MPSoCs. Experimental results on multi-tier 3D MPSoCs show that proposed design-time/run-time management policy prevents the system to exceed the given threshold temperature while reducing cooling energy by 50% on average and system-level energy by 18% on average in comparison to using a static worst- case flow rate setting.
Year
DOI
Venue
2011
10.1109/ISCAS.2011.5938046
Circuits and Systems
Keywords
Field
DocType
multiprocessing systems,power aware computing,system-on-chip,thermal analysis,3D MPSoC,3D stacked architectures,active cooling management,communication delay,design-time analysis,dynamic voltage frequency scaling,inter-tier liquid cooling,multi tier systems,multiprocessor system-on-chips,run-time thermal management policy,thermal analysis
System on a chip,Thermal,Computer science,Active cooling,Computer cooling,Multiprocessing,Electronic engineering,Vertical integration,Multi-core processor,MPSoC
Conference
ISSN
ISBN
Citations 
0271-4302 E-ISBN : 978-1-4244-9472-9
978-1-4244-9472-9
5
PageRank 
References 
Authors
0.43
11
3
Name
Order
Citations
PageRank
Mohamed M. Sabry112110.19
David Atienza22219149.60
Ayse K. Coskun357333.55