Title
Thermal decomposition of silicon-rich oxides deposited by the LPCVD method
Abstract
Silicon-rich oxide (SiOx, 0<;x<;2) thin films were deposited using the Low Pressure Chemical Vapor Deposition (LPCVD) method at temperature of 570 °C using silane (SiH4) and oxygen as the reactant gasses. The films were annealed at temperatures of 800 °C, 900 °C, 1000 °C and 1100 °C to induce the separation of excess silicon in the SiOx films into nanosized crystalline silicon particles inside an amorphous SiOx matrix. The size of the silicon particles was determined using Raman spectroscopy.
Year
DOI
Venue
2011
10.5562/cca1969
Opatija
Keywords
Field
DocType
raman spectra,amorphous state,annealing,chemical vapour deposition,nanostructured materials,pyrolysis,separation,silicon compounds,thin films,lpcvd method,raman spectroscopy,siox,amorphous matrix,low pressure chemical vapor deposition,nanosized crystalline silicon particles,oxygen,reactant gasses,silane,silicon-rich oxides,temperature 1000 degc,temperature 1100 degc,temperature 570 degc,temperature 800 degc,temperature 900 degc,thermal decomposition,silicon,lpcvd
Inorganic chemistry,Chemistry,Thin film,Thermal decomposition,Silicon,Chemical vapor deposition
Conference
Volume
Issue
ISSN
85
1
0011-1643
ISBN
Citations 
PageRank 
978-1-4577-0996-8
0
0.34
References 
Authors
0
6
Name
Order
Citations
PageRank
Davor Ristic103.04
Mile Ivanda226.32
Kresimir Furic311.30
Alessandro Chiasera401.01
enrico moser500.34
maurizio ferrari601.01