Title
Pinned to the walls — Impact of packaging and application properties on the memory and power walls
Abstract
This article presents a study of the impact of packaging on the memory and power walls, in the context of application properties. The analysis is supported by characterizations of 130 hardware designs spanning 30 years, along with both microarchitectural simulation and actual-hardware performance counter measurements of 25 applications. It is shown that if trends in supply pin count (growing as the square root of current) and total packaging pin count (doubling every six years) continue, application memory bandwidth requirements, even in the presence of aggressive cache hierarchies, may limit the number of on-chip threads to under a thousand in 2020.
Year
DOI
Venue
2011
10.1109/ISLPED.2011.5993603
Low Power Electronics and Design
Keywords
Field
DocType
cache storage,integrated circuit packaging,actual-hardware performance counter measurements,aggressive cache hierarchies,application memory bandwidth requirements,hardware designs,memory walls,microarchitectural simulation,power walls
Registered memory,Semiconductor memory,Interleaved memory,Shared memory,Computer science,Electronic engineering,Memory management,Cache coloring,Non-uniform memory access,Computer memory
Conference
ISSN
ISBN
Citations 
Pending E-ISBN : 978-1-61284-659-0
978-1-61284-659-0
14
PageRank 
References 
Authors
0.86
11
3
Name
Order
Citations
PageRank
Phillip Stanley-Marbell121236.03
Victoria Caparros Cabezas2252.79
Ronald P. Luijten3244.06