Name
Title | ||
|---|---|---|
Predicting non-fickian moisture diffusion in EMCs for application in micro-electronic devices |
Abstract | ||
|---|---|---|
This study made an attempt to predict the temperature-dependent moisture diffusion of an epoxy molding compound with 3 different diffusion models: Fickian, dual stage and Langmuir diffusion. The Langmuir model provided the best prediction of the moisture diffusion when simulating the input experiments. Beyond the temperature range of the input experiments, the Langmuir model was still able to provide a fair prediction. Hence, the Langmuir model also provides better predictions for the moisture distribution in general. This allows for building on existing prediction models, enabling simulations of reliability tests like UHST. |
Year | DOI | Venue |
|---|---|---|
2016 | 10.1109/EuroSimE.2015.7103109 | Microelectronics Reliability |
Keywords | Field | DocType |
diffusion,electronics packaging,integrated circuit reliability,integrated circuit testing,life testing,moisture,moulding,emc,fickian diffusion,langmuir diffusion,uhst,diffusion models,dual stage diffusion,epoxy molding compound,microelectronic devices,moisture distribution,prediction models,reliability tests,temperature-dependent moisture diffusion,langmuir model,electronics,electronic devices | Langmuir,Moisture,Electronic engineering,Electronics,Langmuir adsorption model,Fick's laws of diffusion,Moisture diffusion,Epoxy,Materials science,Molding (process) | Journal |
Volume | Issue | ISSN |
62 | 62 | 0026-2714 |
ISBN | Citations | PageRank |
978-1-4799-9949-1 | 0 | 0.34 |
References | Authors | |
1 | 3 | |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Barink, M. | 1 | 0 | 0.34 |
| Mavinkurve, A. | 2 | 0 | 0.34 |
| Janssen, J. | 3 | 0 | 0.34 |