Paper Info
Title
A mm-Sized Implantable Medical Device (IMD) With Ultrasonic Power Transfer and a Hybrid Bi-Directional Data Link
Abstract
A first proof-of-concept mm-sized implantable device using ultrasonic power transfer and a hybrid bi-directional data communication link is presented. Ultrasonic power transfer enables miniaturization of the implant and operation deep inside the body, while still achieving safe and high power levels (100 W to a few mWs) required for most implant applications. The current implant prototype measures 4 mm 7.8 mm and is comprised of a piezoelectric receiver, an IC designed in 65 nm CMOS process and an off-chip antenna. The IC can support a maximum DC load of 100 W for an incident acoustic intensity that is 5% of the FDA diagnostic limit. This demonstrates the feasibility of providing further higher available DC power, potentially opening up new implant applications. The proposed hybrid bi-directional data link consists of ultrasonic downlink and RF uplink. Falling edge of the ultrasound input is detected as downlink data. The implant transmits an ultra-wideband (UWB) pulse sequence as uplink data, demonstrating capability of implementing an energy-efficient M-ary PPM transmitter in the future.
Year
DOI
Venue
2015
10.1109/JSSC.2015.2427336
Solid-State Circuits, IEEE Journal of
Keywords
Field
DocType
ac-dc converter,cmos,imd,active rectifier,antennas,bi-directional data communication,implantable biomedical devices,mm-sized implants,piezoelectric receivers,radio transmitters,ultrasonic power transfer,acoustics,downlink,radio frequency,capacitors
Ultrasonic sensor,Transmitter,Capacitor,Computer science,Radio frequency,Electronic engineering,Miniaturization,Maximum power transfer theorem,Signal edge,Electrical engineering,Telecommunications link
Journal
Volume
Issue
ISSN
PP
99
0018-9200
Citations 
PageRank 
References 
14
0.80
8
Authors
4
Name
Order
Citations
PageRank
Jayant Charthad1140.80
Marcus J. Weber2140.80
Ting Chia Chang3140.80
amin arbabian422735.52