Paper Info
Title
Recent progress in Silicon Photonics R&D and manufacturing on 300mm wafer platform
Abstract
A low cost 28Gbits/s Silicon Photonics platform using 300mm SOI wafers is demonstrated. Process, 3D integration of Electronic and Photonic ICs, device performance, circuit results and low cost packaging are discussed.
Year
DOI
Venue
2015
10.1364/OFC.2015.W3A.1
Optical Fiber Communications Conference and Exhibition
Keywords
DocType
Citations 
semiconductors,decision support systems,microelectronics,copper,internet of things
Conference
2
PageRank 
References 
Authors
0.75
1
28
Name
Order
Citations
PageRank
f boeuf120.75
S. Crémer262.11
enrico temporiti320.75
m fere420.75
m shaw520.75
n vulliet620.75
b orlando720.75
d ristoiu820.75
a farcy920.75
Thierry Pinguet1052.35
attila mekis1152.32
gianlorenzo masini1241.59
peng sun1320.75
yun chi1420.75
h petiton1520.75
s jan1620.75
j r manouvrier1720.75
c baudot1820.75
p le maitre1920.75
jf carpentier2020.75
l salager2120.75
m traldi2220.75
l maggi2320.75
d rigamonti2420.75
c zaccherini2520.75
c elemi2620.75
b sautreuil2720.75
l verga2820.75