Name
Title | ||
|---|---|---|
Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability |
Abstract | ||
|---|---|---|
We demonstrate silicon photonic packaging that can be fully exercised in existing microelectronic packaging facilities. We show low optical loss and point towards notably improved assembly cost and scalability in both volume and optical port-count. |
Year | Venue | Keywords |
|---|---|---|
2015 | Optical Fiber Communications Conference and Exhibition | microelectronics,photonics,packaging,assembly,polymers |
DocType | Citations | PageRank |
Conference | 0 | 0.34 |
References | Authors | |
2 | 16 | |
Name | Order | Citations | PageRank |
|---|---|---|---|
| tymon barwicz | 1 | 2 | 1.64 |
| yoichi taira | 2 | 0 | 0.34 |
| ted lichoulas | 3 | 0 | 0.68 |
| nicolas boyer | 4 | 0 | 0.34 |
| hidetoshi numata | 5 | 1 | 0.82 |
| yves martin | 6 | 0 | 1.69 |
| jaewoong nah | 7 | 4 | 1.13 |
| shotaro takenobu | 8 | 1 | 1.83 |
| alexander jantapolczynski | 9 | 2 | 1.64 |
| eddie kimbrell | 10 | 0 | 0.34 |
| robert k leidy | 11 | 1 | 0.82 |
| marwan h khater | 12 | 8 | 2.74 |
| swetha kamlapurkar | 13 | 4 | 2.26 |
| sebastian u engelmann | 14 | 2 | 2.32 |
| Yurii Vlasov | 15 | 35 | 6.28 |
| paul fortier | 16 | 1 | 0.82 |