Paper Info
Title
3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling
Abstract
Three dimensional stacked integrated circuits (3D ICs) are extremely attractive for overcoming the barriers in interconnect scaling, offering an opportunity to continue the CMOS performance trends for the next decade. However, from a thermal perspective, vertical integration of high-performance ICs in the form of 3D stacks is highly demanding since the effective areal heat dissipation increases with number of dies (with hotspot heat fluxes up to 250 W/cm2) generating high chip temperatures. In this context, inter-tier integrated microchannel cooling is a promising and scalable solution for high heat flux removal. A robust design of a 3D IC and its subsequent thermal management depend heavily upon accurate modeling of the effects of liquid cooling on the thermal behavior of the IC during the early stages of design. In this paper we present 3D-ICE, a compact transient thermal model (CTTM) for the thermal simulation of 3D ICs with multiple inter-tier microchannel liquid cooling. The proposed model is compatible with existing thermal CAD tools for ICs, and offers significant speed-up (up to 975x) over a typical commercial computational fluid dynamics simulation tool while preserving accuracy (i.e., maximum temperature error of 3.4%). In addition, a thermal simulator has been built based on 3D-ICE, which is capable of running in parallel on multicore architectures, offering further savings in simulation time and demonstrating efficient parallelization of the proposed approach.
Year
DOI
Venue
2010
10.1109/ICCAD.2010.5653749
Computer-Aided Design
Keywords
Field
DocType
cooling,integrated circuit design,thermal management (packaging),three-dimensional integrated circuits,3D IC,3D-ICE,compact transient thermal modeling,heat flux removal,intertier integrated microchannel cooling,intertier liquid cooling,thermal management,three dimensional stacked integrated circuits,3D IC,Compact modeling,inter-tier cooling,microchannel
Heat flux,Computer science,Computer cooling,CMOS,Electronic engineering,Chip,Integrated circuit design,Microchannel,Three-dimensional integrated circuit,Integrated circuit
Conference
ISSN
ISBN
Citations 
1092-3152
978-1-4244-8193-4
126
PageRank 
References 
Authors
5.11
10
5
Search Limit
100126
Name
Order
Citations
PageRank
Arvind Sridhar11265.11
Alessandro Vincenzi21265.11
Martino Ruggiero31265.11
Brunschwiler, Thomas41265.11
David Atienza52219149.60