Title
FinFET 3T and 3T1D dynamic RAM cells
Abstract
In this study we present 3T and 3T1D DRAM cells designed using FinFET technology. Overall, the 3T DRAM cell has a 43.6% faster write speed than the 3T1D cell and uses less dynamic current (30.4% less write current and 14.6% less read current). The FinFET 3T1D DRAM cell offers a 16.7% faster read speed and 48.6% less read leakage current than the 3T1D cell. The 3T DRAM cell offers less variation in delays, up to 37% less than the 3T1D cell for write delay, due to parameter corner simulations. Overall for a system, the 3T FinFET DRAM cell is more promising due to its low dynamic current and significantly shorter write speed which leads to a smaller maximum delay.
Year
DOI
Venue
2012
10.1109/MWSCAS.2012.6292055
Midwest Symposium on Circuits and Systems Conference Proceedings
Keywords
Field
DocType
capacitance,logic gates,cmos integrated circuits
Dynamic random-access memory,Dram,Logic gate,Capacitance,Leakage (electronics),Computer science,CMOS,Electronic engineering,MOSFET,CAS latency
Conference
ISSN
Citations 
PageRank 
1548-3746
2
0.36
References 
Authors
0
3
Name
Order
Citations
PageRank
colby m gerik120.36
Michael A. Turi2113.77
Jose G. Delgado-Frias3238.75