Title
Evaluation of non-destructive etch depth measurement for through silicon vias
Year
DOI
Venue
2012
10.1109/ICICDT.2012.6232854
ICICDT
Keywords
Field
DocType
rough surfaces,etching,plasma etching,silicon,optical interferometry,repeated measures,scanning electron microscopy,through silicon via
Plasma etching,Wafer,Etching,Scanning electron microscope,Electronic engineering,Interferometry,Engineering,Trench,Measured depth,Silicon
Conference
Citations 
PageRank 
References 
0
0.34
0
Authors
4
Name
Order
Citations
PageRank
T Dao1101.89
tania thomas200.34
David Marx3795.70
David Grant401.01