Title
Preliminary 3D TCAD electro-thermal simulations of BIMOS transistor in thin silicon film for ESD protection in FDSOI UTBB CMOS technology
Abstract
The purpose of this paper is to analyze the ESD device electro-thermal behavior of BIMOS transistors integrated in ultrathin silicon film for 28 nm FDSOI UTBB high-k metal gate technology. This evaluation is based on 3D TCAD simulations with classical physical models using Average Current Slope (ACS) method and quasi-static DC stress (Average Voltage Slope (AVS) method). We show how the series resistance and the thermal resistance impact the average and peak temperatures in these devices.
Year
DOI
Venue
2015
10.1109/ICICDT.2015.7165913
2015 International Conference on IC Design & Technology (ICICDT)
Keywords
Field
DocType
BIMOS transistor,ESD protection,FDSOI,CMOS
Thermal,Voltage,CMOS,Electronic engineering,Equivalent series resistance,Engineering,Transistor,Metal gate,Silicon,Thermal resistance
Conference
ISSN
Citations 
PageRank 
2381-3555
0
0.34
References 
Authors
0
3
Name
Order
Citations
PageRank
s athanasiou100.68
Sorin Cristoloveanu236.73
Philippe Galy31712.44