Name
Title | ||
|---|---|---|
A Lateral Differential Resonant Pressure Microsensor Based on SOI-Glass Wafer-Level Vacuum Packaging |
Abstract | ||
|---|---|---|
This paper presents the fabrication and characterization of a resonant pressure microsensor based on SOI-glass wafer-level vacuum packaging. The SOI-based pressure microsensor consists of a pressure-sensitive diaphragm at the handle layer and two lateral resonators (electrostatic excitation and capacitive detection) on the device layer as a differential setup. The resonators were vacuum packaged with a glass cap using anodic bonding and the wire interconnection was realized using a mask-free electrochemical etching approach by selectively patterning an Au film on highly topographic surfaces. The fabricated resonant pressure microsensor with dual resonators was characterized in a systematic manner, producing a quality factor higher than 10,000 (similar to 6 months), a sensitivity of about 166 Hz/kPa and a reduced nonlinear error of 0.033% F.S. Based on the differential output, the sensitivity was increased to two times and the temperature-caused frequency drift was decreased to 25%. |
Year | DOI | Venue |
|---|---|---|
2015 | 10.3390/s150924257 | SENSORS |
Keywords | DocType | Volume |
resonant pressure sensor,differential frequency output,vacuum packaging,anodic bonding,wire interconnection,mask-free metallization | Journal | 15 |
Issue | ISSN | Citations |
9.0 | 1424-8220 | 3 |
PageRank | References | Authors |
0.65 | 3 | 6 |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Bo Xie | 1 | 27 | 3.79 |
| yonghao xing | 2 | 3 | 0.65 |
| yanshuang wang | 3 | 3 | 0.65 |
| Jian Chen | 4 | 23 | 15.42 |
| Deyong Chen | 5 | 13 | 10.49 |
| Junbo Wang | 6 | 54 | 16.41 |