Title
Dynamic Wet Etching of Silicon through Isopropanol Alcohol Evaporation.
Abstract
In this paper, Isopropanol (IPA) availability during the anisotropic etching of silicon in Potassium Hydroxide (KOH) solutions was investigated. Squares of 8 to 40 m were patterned to (100) oriented silicon wafers through DWL (Direct Writing Laser) photolithography. The wet etching process was performed inside an open HDPE (High Density Polyethylene) flask with ultrasonic agitation. IPA volume and evaporation was studied in a dynamic etching process, and subsequent influence on the silicon etching was inspected. For the tested conditions, evaporation rates for water vapor and IPA were determined as approximately 0.0417 mL/min and 0.175 mL/min, respectively. Results demonstrate that IPA availability, and not concentration, plays an important role in the definition of the final structure. Transversal SEM (Scanning Electron Microscopy) analysis demonstrates a correlation between microloading effects (as a consequence of structure spacing) and the angle formed towards the (100) plane.
Year
DOI
Venue
2015
10.3390/mi6101437
MICROMACHINES
Keywords
Field
DocType
isopropanol evaporation,isopropanol availability,silicon wet etching,microloading effect
Wafer,Etching,Analytical chemistry,Evaporation,Etching (microfabrication),Photolithography,Reactive-ion etching,Materials science,Silicon,Dry etching
Journal
Volume
Issue
ISSN
6
10
2072-666X
Citations 
PageRank 
References 
0
0.34
0
Authors
5
Name
Order
Citations
PageRank
Tiago S. Monteiro100.34
Pamakstys Kastytis200.34
Luís Gonçalves3456.19
G. Minas475.37
Susana Cardoso5248.02