Name
Title | ||
|---|---|---|
Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding |
Abstract | ||
|---|---|---|
Three different heavy aluminum wire qualities were investigated regarding their microstructural evolution after ultrasonic bonding by electron backscatter diffraction and nanoindentation. The results complete the findings of our recent research regarding the effect of bonding mechanisms on the wire bond microstructure and its local mechanical properties. Local elastic-plastic material parameters of the bonded wires were approximated on the basis of the elastic anisotropy of crystals and a correlation between hardness and stress. (C) 2015 Elsevier Ltd. All rights reserved. |
Year | DOI | Venue |
|---|---|---|
2015 | 10.1016/j.microrel.2015.06.061 | MICROELECTRONICS RELIABILITY |
Keywords | Field | DocType |
Ultrasonic wire bonding,Electron backscatter diffraction (EBSD),Hardness,Aluminum | Microstructure,Wire bonding,Aluminium,Anisotropy,Crystal,Electron backscatter diffraction,Metallurgy,Engineering,Nanoindentation,Elasticity (economics) | Journal |
Volume | Issue | ISSN |
55 | 9-10 | 0026-2714 |
Citations | PageRank | References |
0 | 0.34 | 4 |
Authors | ||
7 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Marian Sebastian Broll | 1 | 0 | 0.34 |
| Ute Geissler | 2 | 1 | 0.75 |
| Jan Höfer | 3 | 1 | 0.75 |
| S. Schmitz | 4 | 1 | 1.09 |
| Olaf Wittler | 5 | 4 | 3.01 |
| M. Schneider-Ramelow | 6 | 0 | 2.03 |
| K. Dieter Lang | 7 | 10 | 7.04 |