Name
Title | ||
|---|---|---|
Development of C-Line plot technique for the characterization of edge effects in acoustic imaging: A case study using flip chip package geometry |
Abstract | ||
|---|---|---|
Edge effect is a common phenomenon observed in acoustic micro-imaging of microelectronic packages. In this paper, using flip chip package geometry as a test vehicle, finite element modelling is carried out to study the fundamental mechanism of the edge effect phenomenon. C-Line plot technique is developed for the characterization of edge effects in acoustic C-scan images, in particular solder joint C-scan images. Simulated results are compared to experimental results. Results reveal that edge effect generation is mainly attributed to the under-bump-metallisation structure. In addition, through analysis of the C-Line profile of edge effects, the impact of the transducer focal point and the spot size on the edge effect is investigated. Results show that slight off-focus can reduce the severity of the edge effect in which image sharpness is a trade-off. |
Year | DOI | Venue |
|---|---|---|
2015 | 10.1016/j.microrel.2015.08.005 | Microelectronics Reliability |
Keywords | Field | DocType |
Edge effect,Flip chip packages,Acoustic micro-imaging,Finite element modelling,Under-bump-metallisation | Transducer,Flip chip,Focal point,Microelectronics,Electronic engineering,Finite element method,Soldering,Line plot survey,Engineering,Optoacoustic imaging,Geometry | Journal |
Volume | Issue | ISSN |
55 | 12 | 0026-2714 |
Citations | PageRank | References |
1 | 0.40 | 3 |
Authors | ||
4 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Chean Shen Lee | 1 | 1 | 0.40 |
| Guang-Ming Zhang | 2 | 5 | 2.00 |
| David M. Harvey | 3 | 1 | 0.40 |
| Hong-Wei Ma | 4 | 1 | 0.40 |