Title
Failure mechanism study and immunity modeling of an embedded analog-to-digital converter based on immunity measurements
Abstract
In this paper, the failure mechanism of an embedded analog-to-digital converter (ADC) is studied and its immunity modeling with regard to electromagnetic interferences is presented. Failure causes are identified based on off-chip immunity measurements and without specific knowledge of the ADC's design. Disturbances coupling paths inside the ADC have been recognized as well as the conversion error mechanism. Then, immunity of the ADC is modeled using the ICIM-CI (Integrated Circuit Immunity Model for Conducted Immunity) black-box modeling approach. We show the interest of using the direct power injection (DPI) measurement technique for both analyzing and modeling the immunity of complex.integrated circuits. (C) 2015 Elsevier Ltd. All rights reserved.
Year
DOI
Venue
2015
10.1016/j.microrel.2015.06.109
MICROELECTRONICS RELIABILITY
Keywords
Field
DocType
EMC/EMI,Conducted immunity,Immunity modelling,ADC
Failure causes,Coupling,Immunity,Analog-to-digital converter,Electronic engineering,Engineering,Integrated circuit,Power injection,Electrical engineering
Journal
Volume
Issue
ISSN
55
9-10
0026-2714
Citations 
PageRank 
References 
2
0.36
1
Authors
4
Name
Order
Citations
PageRank
Ayed, A.120.70
Tristan Dubois272.81
Jean-luc Levant3138.64
Geneviève Duchamp4125.38