Name
Abstract | ||
|---|---|---|
•The microstructural evolution of ultrasonic bonded aluminum wires is studied.•We observed the evolution of a rotated cube textured area after wire bonding.•The crack growth behavior during active power cycling is characterized.•Microstructural effects on wire bond reliability were discussed and assessed. |
Year | DOI | Venue |
|---|---|---|
2015 | 10.1016/j.microrel.2015.03.002 | Microelectronics Reliability |
Keywords | Field | DocType |
Electron backscatter diffraction (EBSD),Texture,Wire bonding,Crack growth,Reliability | Grain growth,Microstructure,Wire bonding,Wedge (mechanical device),Fracture mechanics,Electron backscatter diffraction,Metallurgy,Engineering,Deformation (mechanics),Nanoindentation | Journal |
Volume | Issue | ISSN |
55 | 6 | 0026-2714 |
Citations | PageRank | References |
1 | 0.41 | 1 |
Authors | ||
6 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Marian Sebastian Broll | 1 | 1 | 0.41 |
| Ute Geissler | 2 | 1 | 0.75 |
| Jan Höfer | 3 | 1 | 0.75 |
| S. Schmitz | 4 | 1 | 1.09 |
| Olaf Wittler | 5 | 4 | 3.01 |
| K.-D. Lang | 6 | 1 | 1.42 |