Paper Info
Title
Using SOM neural network for X-ray inspection of missing-bump defects in three-dimensional integration
Abstract
Three-dimensional integration has been a key technology in scientific research and industrial production of integrated circuits, where microbumps bridge multiple layers of chips. Microbump defect inspection, especially for missing-bump, is of major significance. We introduce self-organizing map network combined with X-ray imaging, and demonstrate a non-destructive method for rapid and effective inspection of missing microbump defects. 2D X-ray images of samples with microbumps are segmented, and vectors consisting of four features as representatives of microbumps are extracted. A self-organizing map network is constructed, and vectors of microbumps selected randomly from four samples are inputted into the network. Clusters of the defective bumps and the normal bumps are distinguished obviously. Then the other microbumps from the same samples are used for testing. The trained network can recognize the defective and normal microbumps through the clustering areas with no error. Microbumps from a different sample are inputted to the network for further verification, and high recognition accuracy is achieved. These prove the feasibility of using self-organizing map network for X-ray inspection of missing-bump defects.
Year
DOI
Venue
2015
10.1016/j.microrel.2015.09.009
Microelectronics Reliability
Keywords
Field
DocType
Three-dimensional integration,Missing-bump defect,X-ray,Self-organizing map neural network
Computer vision,Self organizing map neural network,Three dimensional integration,Artificial intelligence,Engineering,Cluster analysis,Artificial neural network,Integrated circuit
Journal
Volume
Issue
ISSN
55
12
0026-2714
Citations 
PageRank 
References 
3
0.50
8
Authors
7
Name
Order
Citations
PageRank
Guanglan Liao1369.69
Pengfei Chen230.84
Li Du340.86
Lei Su440.86
Zhiping Liu530.50
Zirong Tang642.90
Tielin Shi79017.20