Title
Fabrication of high performance AlGaN/GaN FinFET by utilizing anisotropic wet etching in TMAH solution
Abstract
AlGaN/GaN-based fin-shaped field-effect transistors (FinFETs) with very steep sidewall and various fin widths (W-fin) have been fabricated by utilizing electron-beam lithography and additional anisotropic sidewall wet etch in tetramethyl ammonium hydroxide (TMAH) solution. The device with W-fin of 180 nm exhibits normally-on performance with threshold voltage of - 3.5 V and extremely broad transconductance (g(m)) characteristic ranging from - 2 to similar to 3 V at V-D = 5 V which is essential for high linearity device performance. This broad g(m) characteristic is because the current from the side -wall MOS channel becomes comparable to that from the two-dimensional electron gas (2DEG) channel and hence significantly contributes to the total device current. On the other hand, devices with smaller W-fin = 50 and 100 nm exhibit normally-off performance with positive threshold voltage of 2.0 and 0.6 V, respectively, and less broad gm characteristics because the current from the side-wall MOS channel dominates the total device current.
Year
Venue
Keywords
2015
Proceedings of the European Solid-State Device Research Conference
AlGaN/GaN,FinFET,TMAll wet etch,2DEG channel,sidewall MOS channel
Field
DocType
ISSN
Analytical chemistry,Etching (microfabrication),Linearity,Electronic engineering,Lithography,Fermi gas,Transconductance,Transistor,Materials science,Threshold voltage,Fabrication
Conference
1930-8876
Citations 
PageRank 
References 
0
0.34
0
Authors
9
Name
Order
Citations
PageRank
Dong-Hyeok Son100.68
Young-woo Jo200.34
Ryun-Hwi Kim300.34
Chan Heo400.34
Jae Hwa Seo501.35
Jin Su Kim600.34
In Man Kang702.70
Sorin Cristoloveanu836.73
Junghee Lee922627.26