Title | ||
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Fabrication of high performance AlGaN/GaN FinFET by utilizing anisotropic wet etching in TMAH solution |
Abstract | ||
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AlGaN/GaN-based fin-shaped field-effect transistors (FinFETs) with very steep sidewall and various fin widths (W-fin) have been fabricated by utilizing electron-beam lithography and additional anisotropic sidewall wet etch in tetramethyl ammonium hydroxide (TMAH) solution. The device with W-fin of 180 nm exhibits normally-on performance with threshold voltage of - 3.5 V and extremely broad transconductance (g(m)) characteristic ranging from - 2 to similar to 3 V at V-D = 5 V which is essential for high linearity device performance. This broad g(m) characteristic is because the current from the side -wall MOS channel becomes comparable to that from the two-dimensional electron gas (2DEG) channel and hence significantly contributes to the total device current. On the other hand, devices with smaller W-fin = 50 and 100 nm exhibit normally-off performance with positive threshold voltage of 2.0 and 0.6 V, respectively, and less broad gm characteristics because the current from the side-wall MOS channel dominates the total device current. |
Year | Venue | Keywords |
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2015 | Proceedings of the European Solid-State Device Research Conference | AlGaN/GaN,FinFET,TMAll wet etch,2DEG channel,sidewall MOS channel |
Field | DocType | ISSN |
Analytical chemistry,Etching (microfabrication),Linearity,Electronic engineering,Lithography,Fermi gas,Transconductance,Transistor,Materials science,Threshold voltage,Fabrication | Conference | 1930-8876 |
Citations | PageRank | References |
0 | 0.34 | 0 |
Authors | ||
9 |
Name | Order | Citations | PageRank |
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Dong-Hyeok Son | 1 | 0 | 0.68 |
Young-woo Jo | 2 | 0 | 0.34 |
Ryun-Hwi Kim | 3 | 0 | 0.34 |
Chan Heo | 4 | 0 | 0.34 |
Jae Hwa Seo | 5 | 0 | 1.35 |
Jin Su Kim | 6 | 0 | 0.34 |
In Man Kang | 7 | 0 | 2.70 |
Sorin Cristoloveanu | 8 | 3 | 6.73 |
Junghee Lee | 9 | 226 | 27.26 |