Paper Info
Title
Defect Clustering-Aware Spare-TSV Allocation for 3D ICs
Abstract
The manufacturing yield challenge of three-dimensional integrated circuit (3D ICs) is one of the key obstacles in the industry adoption of 3D integration based on through-silicon-vias (TSVs). The addition of spare TSVs to repair faulty functional TSVs is an effective method for yield and reliability enhancement, but this approach results in significant hardware cost and delay overhead. Most existing solutions are only suitable for a "dual-uniform" scenario in which both the placement and the defect probabilities of functional TSVs are assumed to be uniform. In this paper, we propose a design technique that is compatible with non-uniform TSV placement and it can repair faulty TSVs based on a realistic clustered defect-distribution model. The proposed solution is based on two consecutive stages, which utilize a greedy algorithm and an integer-linear-programming formulation, respectively. By considering the trade-off between chip yield, hardware cost, and delay overhead, the proposed technique provides higher yield and reliability under a clustered defect distribution, and with minimum hardware cost and delay overhead, compared to the previous work.
Year
DOI
Venue
2015
10.1109/ICCAD.2015.7372585
International Conference on Computer-Aided Design
Keywords
Field
DocType
defect clustering aware spare TSV allocation,3D integrated circuit,manufacturing yield,through silicon vias technology,design technique,nonuniform TSV placement and,faulty TSV repair,clustered defect distribution model
Spare part,Computer science,Effective method,Greedy algorithm,Electronic engineering,Chip,Electronic design automation,Cluster analysis,Integrated circuit,Maintenance engineering,Reliability engineering,Embedded system
Conference
ISSN
ISBN
Citations 
1933-7760
978-1-4673-8389-9
2
PageRank 
References 
Authors
0.37
28
3
Name
Order
Citations
PageRank
Shengcheng Wang1134.29
Mehdi B. Tahoori21537163.44
K Chakrabarty38173636.14