Name
Title | ||
|---|---|---|
Simple and low cost technique for stacking known good dies to create compact 3D stacked parallel optics assemblies |
Abstract | ||
|---|---|---|
We demonstrate a method for stacking and connecting KGD on each other. The method requires no pre-processing of the ICs and die placement can be done using standard pick and place machines. This novel process allows creating >200um high lithographically defined interconnects and is a simple, scalable and low cost alternative to other techniques for interconnecting 3D stacked ICs. |
Year | DOI | Venue |
|---|---|---|
2014 | 10.1109/3DIC.2014.7152155 | 2014 International 3D Systems Integration Conference (3DIC) |
Keywords | Field | DocType |
optical interconnects,3D stacking | Electronic engineering,Die (manufacturing),SMT placement equipment,Materials science,Scalability,Stacking | Conference |
ISSN | Citations | PageRank |
2164-0157 | 0 | 0.34 |
References | Authors | |
1 | 3 | |
Name | Order | Citations | PageRank |
|---|---|---|---|
| o raz | 1 | 0 | 2.70 |
| P. Duan | 2 | 0 | 0.34 |
| H. J. S. Dorren | 3 | 3 | 4.66 |