Name
Title | ||
|---|---|---|
Cu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias |
Abstract | ||
|---|---|---|
High aspect ratio through-Si vias (AR=16.7) filling has been achieved by using non-PVD seed metallization approach. We demonstrate the formation of conformal and thin electroless deposited Cu seed on Ru liner. The optimized ELD Cu process was conducted at room temperature on activated Ru surface, which can improve the ELD bath life time. The deposited Cu with 2,2′ bipyridyl shows smoother and higher purity inside the Cu film. |
Year | DOI | Venue |
|---|---|---|
2014 | 10.1109/3DIC.2014.7152147 | 2014 International 3D Systems Integration Conference (3DIC) |
Keywords | Field | DocType |
Through-Si Via,Cu seed,Metallization,Elecroless deposition,High aspect ratio | Surface cleaning,Annealing (metallurgy),Electroless deposition,Metallurgy,Aspect ratio (aeronautics),Materials science,Seeding,Life time | Conference |
ISSN | Citations | PageRank |
2164-0157 | 0 | 0.34 |
References | Authors | |
0 | 7 | |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Fumihiro Inoue | 1 | 1 | 3.74 |
| Harold Philipsen | 2 | 1 | 0.89 |
| Marleen H. van der Veen | 3 | 0 | 0.34 |
| Kevin Vandersmissen | 4 | 0 | 0.34 |
| Stefaan Van Huylenbroeck | 5 | 1 | 0.89 |
| Herbert Struyf | 6 | 0 | 0.34 |
| Tetsu Tanaka | 7 | 77 | 13.36 |