Name
Title | ||
|---|---|---|
Three-dimensional integrated circuits and stacked CMOS image sensors using direct bonding of SOI layers |
Abstract | ||
|---|---|---|
We report on three-dimensionally (3D) integrated circuits and stacked CMOS image sensors by using the direct bonding of silicon-on-insulator (SOI) layers. Since the developed process allows small embedded Au electrodes by damascene process, high-density integration is possible within an image sensor pixel area of a few micrometers, beyond the limit of the conventional technique such as through silicon vias (TSVs). We confirmed a successful operation of the developed 3D integrated circuits with NFETs and PFETs bonded from separate wafers. We also demonstrated stacked CMOS image sensor with pixel-wise 3D integration, which indicates that our technology is promising for high-density integrated circuits and CMOS image sensors. |
Year | DOI | Venue |
|---|---|---|
2015 | 10.1109/3DIC.2015.7334562 | 2015 International 3D Systems Integration Conference (3DIC) |
Keywords | Field | DocType |
CMOS integrated circuits,CMOS image sensors,silicon-on-insulator (SOI),three-dimensional integration | Silicon on insulator,Wafer,Image sensor,CMOS,CMOS sensor,Copper interconnect,Electronic engineering,Direct bonding,Integrated circuit,Materials science | Conference |
ISSN | Citations | PageRank |
2164-0157 | 0 | 0.34 |
References | Authors | |
0 | 9 | |
Name | Order | Citations | PageRank |
|---|---|---|---|
| Masahide Goto | 1 | 0 | 1.01 |
| Kei Hagiwara | 2 | 0 | 0.68 |
| Yoshinori Iguchi | 3 | 0 | 0.34 |
| Hiroshi Ohtake | 4 | 595 | 39.22 |
| Takuya Saraya | 5 | 1 | 2.17 |
| Masaharu Kobayashi | 6 | 0 | 1.01 |
| Eiji Higurashi | 7 | 10 | 6.19 |
| Hiroshi Toshiyoshi | 8 | 24 | 13.54 |
| Toshiro Hiramoto | 9 | 27 | 8.14 |