Name
Abstract | ||
|---|---|---|
This paper presents a methodology to construct an equivalent circuit model of a packaged integrated circuit mounted on a field-induced charged device model electrostatic discharge tester. Circuit simulation is used to obtain the full-component current and voltage distributions. This paper focuses on predicting overvoltage stress at power domain crossing circuits. |
Year | DOI | Venue |
|---|---|---|
2016 | 10.1109/TCAD.2015.2495196 | IEEE Trans. on CAD of Integrated Circuits and Systems |
Keywords | Field | DocType |
Integrated circuit modeling,Substrates,Junctions,Stress,Electrostatic discharges,Capacitors,Metals | Capacitor,Modeling and simulation,Electrostatic discharge,Computer science,Overvoltage,Electronic engineering,Electronic circuit,Integrated circuit,Electrical engineering,Equivalent circuit,Charged-device model | Journal |
Volume | Issue | ISSN |
35 | 7 | 0278-0070 |
Citations | PageRank | References |
3 | 0.36 | 5 |
Authors | ||
3 | ||
Name | Order | Citations | PageRank |
|---|---|---|---|
| Kuo-Hsuan Meng | 1 | 4 | 0.84 |
| Vrashank Shukla | 2 | 3 | 0.36 |
| Elyse Rosenbaum | 3 | 61 | 21.99 |